Electronics engineering and microprocessor firmware development – Board design and engineering with the most popular CAE/CAD – Systems (MENTOR VX Exp./Pads, CADENCE Orcad/Allegro) – Simulation of high speed signals by HYPERLYNX system – PCB manufacturing – Manage of components shortage by research on world market – Assembly of prototypes with high complexity within 48/72 hours – Assembly of small and medium series within 1/2 wks – Supply boards in a full account, including any kind of components, or partial account – Boards testing by flying probe and repair, BGA/QFN rework – Conformal coating with acrylic and silicon products – Out of production boards reverse engineering by flying probe tester – Design of custom mechanical parts with 3D CAD systems – 3D printing prototypes in plastic or metal materials – Manufacturing of mechanical parts in aluminum or steel.
SPEA 4060S2:
Large test area 686 x 610 mm – Min. package dim. 01005 /Min. pitch 100um – N° 6 flying probes (4 top / 2 bottom) – Soft touch probing – No specific test points pads required – High accuracy on precision components measurement – High sensitivity for leakage current test with a min. value of 2.5 nA – Detailed control of individual components by microscopes with high magnification – Integrated AOI systems by high resolution cameras – Functional and power consumption test – Microprocessors firmware flashing by OBP integrate systems. – Dual BMU 9 pins bed of nails mounted two independent axis.
SMD Assembly:
N.2 P&P full automatic machine – Large board size up to 740 x 580 mm, thickness 7 mm – Discrete components with dim. min: 0201 – BGA / QFN with a minimum pitch of 0.4 mm – Up to 120 item can be charged simultaneously – Placement rate of more than 5000 comp/hour – Automatic valve for solder paste and glue dispensing – High precision assembly +/-50 um, by dual cameras (on the fly + cockpit) – Software for direct import of CAD, CAM, ASCII and ODB++ – Very easy and fast programming to reduce setup costs.
We specialize in provide a superior service and rapid assembly of prototypes in accordance with industry 4.0 specifications.
Industry Applications of Printed Circuit Boards Clarydon Electronic Services has supported businesses with
the manufacturing & assembly of PCB for Electronic Devices in a wide variety of market sectors,
both in the IT and Internationally. Here are just a few of our areas of interest:
A new production unit, specialized in production of small-medium series, was opened in 2017 in Omegna (via Verta, 43).
Since 2019 the operational and logistics Plant has been moved to Gravellona Toce (Corso Milano, 187).
Accordingly to industry 4.0 specifications in the new production section are installed new machines of the latest generation.
