1. Flying Probe Test System:
Large test area 686 x 610 mm
Min. package dim. 01005 /Min. pitch 100um
NÂ° 6 flying probes (4 top / 2 bottom)
Soft touch probing
No specific test points pads required
High accuracy on precision components measurement
High sensitivity for leakage current test with a min. value of 2.5 nA
Detailed control of individual components by microscopes with high magnification
Integrated AOI systems by high resolution cameras
Functional and power consumption test
Microprocessors firmware flashing by OBP integrate systems.
Dual BMU 9 pins bed of nails mounted two independent axis.
2. High-end Hybrid AOI System 3D optical inspection:
Large board capability: max size 660 x 560 mm
Resolution: Optical light (RGB) & infrared light: 12 μm / 7 μm (selectable)
Improved Inspection Capacity/performance for Extremely Small-sized Components Including 0201
Increased Specular Component Inspection Performance
Four colours (white, blue, red and yellow) LED light sources for welds analisys
Intelli-Beam laser system with 15 um / point resolution for BGA planarity checking
Automatic detect of any assembly error and/or defective welds
3D inspection by Moire projectors and angular inspection by 4 directions side camera
Height and sloped surface 3D inspection components for detection of extra components or contamination as solder ball black material
The continue new technical requirements of our customers, allow us to continue improve our competences by research and development of innovative solutions.